
Advantages of diamond wire saw for stone cutting
- Categories:diamond wire saw for stone cutting
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- Time of issue:2021-03-12 15:30
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(Summary description)Diamond wire saw for stone cutting, also known as diamond wire, refers to the use of electroplating process or resin bonding method to fix the diamond abrasive on the metal wire.
Advantages of diamond wire saw for stone cutting
(Summary description)Diamond wire saw for stone cutting, also known as diamond wire, refers to the use of electroplating process or resin bonding method to fix the diamond abrasive on the metal wire.
- Categories:diamond wire saw for stone cutting
- Author:
- Origin:
- Time of issue:2021-03-12 15:30
- Views:
Diamond wire saw for stone cutting, also known as diamond wire, refers to the use of electroplating process or resin bonding method to fix the diamond abrasive on the metal wire.
In the 1990s, in order to solve the problem of processing large-size silicon wafers, wire saw processing technology was used to cut silicon rods into pieces. The early wire saw processing technology used exposed metal wires and free abrasives. During the processing, the abrasive was added to the metal wire and the workpiece to produce cutting action. This technique has been successfully used for the processing of silicon and silicon carbide. In order to further shorten the processing time, as well as to process other hard materials and difficult-to-process ceramics, people fix the diamond abrasive to the metal wire in a certain way, resulting in a fixed diamond wire saw for stone cutting.
1. Electroplating type: A linear superhard material tool made by depositing a layer of metal (usually nickel and nickel-cobalt alloy) on a metal wire by electroplating, and consolidating diamond abrasives in the metal. The metal coating is the bonding agent, and the diamond abrasive is used for cutting.
Electroplating diamond wire saw for stone cutting can be made into different diameters and lengths according to needs; wire saws can be installed on different equipment to form different processing methods, such as reciprocating cycle (saw frame) type, high-speed band saw type, wire cutting type Wait. For the processing of hard and brittle materials, wire saws can not only cut thin slices, but also process curved surfaces, and can also be used for the training of small holes. Its application prospects are broad. At present, Nanjing Sanchao New Materials Co., Ltd. is a relatively mature enterprise producing electroplated diamond wire saw for stone cutting in China, with early R&D investment and strong technical strength.
2. Resin type: Use resin as a bonding agent to consolidate diamond abrasives on metal wires.
Application areas:
1. Solar energy field: cutting squares of monocrystalline silicon ingots or polycrystalline silicon ingots; slicing of silicon wafers.
2. LED field: square sapphire crystal bar, slice.
3. Other fields: magnetic materials such as neodymium magnets or ferrite magnets; silicon carbide and other difficult-to-cut materials, various substrates; crystal slices; ceramic cutting.
Cutting advantages:
Different from the previous mortar cutting technology, diamond wire saw for stone cutting uses multi-wire cutting technology. This technology has strong cutting ability and high efficiency; the wire diameter size control of diamond wire saw for stone cutting is very strict, the cutting loss of cutting material is small, and the cutting product precision is high; because it does not use mortar, the working environment is clean, An energy-saving and environmentally friendly product.
Electroplating diamond wire saw for stone cutting has its unique advantages:
(1) Compared with free abrasive wire saws, it has higher processing efficiency and lower energy consumption;
(2) It can avoid the cumbersome processes of mixing, granulating, sintering, welding (or injection molding) in the manufacturing process of sintered diamond tools;
(3) It can be used to process non-conductors that cannot be processed by EDM Ⅱ)M;
(4) The diamond wire saw for stone cutting is wound around the drum, which can simultaneously cut processed parts (such as silicon rods) and process multiple processed parts at the same time;
(5) Due to the spacing between the sintered diamond wire saw for stone cutting beads, the spacing part may be worn prematurely and cause the wire (wire) to break, and the continuous distribution of diamond in the electroplated diamond wire saw for stone cutting can avoid the wire saw (6) Compared with circular saws and band saws, wire saws can flexibly change the cutting direction and can be used to process complex geometric shapes;
(7) Due to the small diameter of the wire saw (generally <1ram), the notch loss during processing is small, which is of great significance for the processing of expensive semiconductors and gems.
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