The best Diamond wire saw cutting technology in china is a new slicing technology that uses steel wire with diamond particles instead of steel wire and mortar. Compared with the current mortar cutting technology, it has the advantages of fast cutting speed, low environmental load and easy recycling of cutting sawdust.

1. High cutting speed of diamond wire saw in china. Mortar cutting is a "three-body processing" in which saw wire, abrasive and silicon wafer interact. The three are always in relative motion in the cutting process, and their forces are easy to disperse.The best Diamond cutting is a "two-body processing" in which saw wire directly cuts silicon wafer. In the cutting process, the fixed diamond particles are subjected to uniform force and single direction, and the force utilization rate is higher, Easier to cut effectively. The cutting rate of diamond is more than 2.5 times that of free abrasive wire saw;

2. The diamond wire saw silicon chip has good quality, shallower surface damage [15,16], good uniformity of silicon chip thickness, low silicon material loss and easy to obtain silicon chip;

3. The best Diamond wire saw in china does not need to add grinding slurry such as SiC and polyethylene glycol, but only needs water-based coolant. The recovery, purification and reuse of cutting fluid and silicon sawdust are simple, convenient and efficient. Diamond cutting can greatly reduce the processing cost of silicon wafer and reduce the pollution to the environment;

4. The best Diamond wire sawdust is easy to recycle.

5. The silicon wafer cut by diamond wire saw in china has good photovoltaic application performance. The conversion efficiency of monocrystalline silicon cut by diamond wire saw is 0.1 ~ 0.15% higher than that cut by mortar.

The thickness of damage layer of silicon wafer cut by diamond wire saw is 6 μ m. Thickness of damaged layer of polycrystalline silicon wafer cut by mortar 10 μ m。